New Release! MT-FIMMPROP
This industry shifting optional expansion to FIMMPROP allows for multiple EME simulations to be
combined natively in a layout environment to design, simulate, and export entire PIC devices with a single tool.
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OMNISIM 8.1 adds features across the board including 'total field/ scattered field'
exciters to FDTD to investigate scattering due to an
individual element in a bound volume.
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Harold 7.1 This update includes support for wurtzite materials and non-linearly
graded layers as well as improvements to
Harold's QCSE permittivity solver.
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EPIPPROP 3.4.
This update includes: New process type ‘Etch & Fill’ allows for more flexible waveguide geometry.
Layer thicknesses can now have random variations defined by an import file.
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